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Single wafer spin peeling equipment Product List

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Leaf Spin Stripping Device WSR-200CBT/WSR-300CBT

Leaf Spin Stripping Device WSR-200CBT/WSR-300CBT

Device dimensions: 1200W × 1100D × 2000H (200CBT) / 1500W × 1100D × 2000H (300CBT)

Set the substrate in the chuck manually, perform the peeling process, rinse, and spin dry.

  • Other semiconductor manufacturing equipment
  • Single wafer spin peeling equipment

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